Microstructure and mechanical behavior of SnBi-xAg and SnBi-xAg@P-Cu solder joints during isothermal aging
In: Microelectronics Reliability, Jg. 127 (2021-12-01)
academicJournal
Zugriff:
Titel: |
Microstructure and mechanical behavior of SnBi-xAg and SnBi-xAg@P-Cu solder joints during isothermal aging
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Autor/in / Beteiligte Person: | Liu, Yang ; Ren, Boqiao ; Xue, Yuxiong ; Zhou, Min ; Cao, Rongxing ; Chen, Penghui ; Zeng, Xianghua |
Link: | |
Zeitschrift: | Microelectronics Reliability, Jg. 127 (2021-12-01) |
Veröffentlichung: | 2021 |
Medientyp: | academicJournal |
ISSN: | 0026-2714 (electronic) |
DOI: | 10.1016/j.microrel.2021.114388 |
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