Thermal stress analysis for a CMOS-MEMS microphone with various metallization and materials
In: Microelectronic Engineering, Jg. 213 (2019-05-15), S. 47-54
academicJournal
Zugriff:
Titel: |
Thermal stress analysis for a CMOS-MEMS microphone with various metallization and materials
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Autor/in / Beteiligte Person: | Lu, Chun-Lin ; Yeh, Meng-Kao |
Link: | |
Zeitschrift: | Microelectronic Engineering, Jg. 213 (2019-05-15), S. 47-54 |
Veröffentlichung: | 2019 |
Medientyp: | academicJournal |
ISSN: | 0167-9317 (electronic) |
DOI: | 10.1016/j.mee.2019.04.013 |
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