Through-Silicon Vias for 3D Integration
2012
Online
E-Book
Zugriff:
Titel: |
Through-Silicon Vias for 3D Integration
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Autor/in / Beteiligte Person: | Lauhor, John |
Link: | |
Veröffentlichung: | 2012 |
Medientyp: | E-Book |
ISBN: | 978-0-07-178515-0 (print) ; 0-07-178515-9 (print) ; 978-0-07-178514-3 (print) |
DOI: | 10.1036/9780071785150 |
Sonstiges: |
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