Dual metal core multilayer boards (MLBS) – a better option for high speed spacecraft electronic packaging applications
In: Circuit World, Jg. 32 (2006-05-01), Heft 2, S. 30-38
Online
academicJournal
Zugriff:
Titel: |
Dual metal core multilayer boards (MLBS) – a better option for high speed spacecraft electronic packaging applications
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Autor/in / Beteiligte Person: | Hanumanth Rao, C. ; Varghese, Jissy ; Suresh, A. ; Baliga, B.N. |
Link: | |
Zeitschrift: | Circuit World, Jg. 32 (2006-05-01), Heft 2, S. 30-38 |
Veröffentlichung: | 2006 |
Medientyp: | academicJournal |
ISSN: | 0305-6120 (print) |
DOI: | 10.1108/03056120610642888 |
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