Thermal Resistance and Temperature Cycling Endurance of DCB Substrates
In: Microelectronics International: An International Journal, Jg. 7 (1990-02-01), Heft 2, S. 29-33
Online
academicJournal
Zugriff:
Titel: |
Thermal Resistance and Temperature Cycling Endurance of DCB Substrates
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Autor/in / Beteiligte Person: | Martin, W. ; Waibel, B. ; Laaser, W. |
Link: | |
Zeitschrift: | Microelectronics International: An International Journal, Jg. 7 (1990-02-01), Heft 2, S. 29-33 |
Veröffentlichung: | 1990 |
Medientyp: | academicJournal |
ISSN: | 1356-5362 (print) |
DOI: | 10.1108/eb044413 |
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