Vertically high-density interconnection for mobile application
In: Microelectronics and Reliability, Jg. 46 (2006-05-01), Heft 5-6, S. 756-762
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Zugriff:
Titel: |
Vertically high-density interconnection for mobile application
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Autor/in / Beteiligte Person: | Katahira, Takayoshi ; Kartio, Ilkka ; Segawa, Hiroshi ; Takahashi, Michimasa ; Sagisaka, Katsumi |
Link: | |
Zeitschrift: | Microelectronics and Reliability, Jg. 46 (2006-05-01), Heft 5-6, S. 756-762 |
Veröffentlichung: | 2006 |
Medientyp: | serialPeriodical |
ISSN: | 0026-2714 (print) |
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