Invensas Unveils Multi-Die Face-Down Packaging Technology at IDF
In: Business Wire, 2011-09-06
Zeitungsartikel
Zugriff:
SAN JOSE, Calif. -- Invensas Corporation, a wholly-owned subsidiary of Tessera Technologies, Inc. (Nasdaq:TSRA), announced that it will demonstrate the dual-face down (DFD) implementation of its new multi-die face-down (xFD) [...]
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Invensas Unveils Multi-Die Face-Down Packaging Technology at IDF
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Zeitschrift: | Business Wire, 2011-09-06 |
Veröffentlichung: | 2011 |
Medientyp: | Zeitungsartikel |
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