Invensas Targets Ultrabooks and Tablet Applications with DIMM-IN-A-PACKAGE Solution Based on xFD Technology
In: Electronics Newsweekly, 2012-04-25, S. 55
Zeitungsartikel
Zugriff:
Invensas Corporation, a leading provider of semiconductor technology solutions and wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), today introduced its DIMM-IN-A-PACKAGETM multi-die face-down (xFD)TM technology for thin and [...]
Titel: |
Invensas Targets Ultrabooks and Tablet Applications with DIMM-IN-A-PACKAGE Solution Based on xFD Technology
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Zeitschrift: | Electronics Newsweekly, 2012-04-25, S. 55 |
Veröffentlichung: | 2012 |
Medientyp: | Zeitungsartikel |
ISSN: | 1944-1630 (print) |
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