Researchers Submit Patent Application, 'Substrate Processing Apparatus Including Electrostatic Chuck, Substrate Processing Method, And Method Of Manufacturing Electrostatic Chuck', for Approval (USPTO 20230064141)
In: Electronics Newsweekly, 2023-03-21, S. 7736
Zeitungsartikel
Zugriff:
2023 MAR 21 (VerticalNews) -- By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventors KIM, Kyo [...]
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Researchers Submit Patent Application, 'Substrate Processing Apparatus Including Electrostatic Chuck, Substrate Processing Method, And Method Of Manufacturing Electrostatic Chuck', for Approval (USPTO 20230064141)
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Zeitschrift: | Electronics Newsweekly, 2023-03-21, S. 7736 |
Veröffentlichung: | 2023 |
Medientyp: | Zeitungsartikel |
ISSN: | 1944-1630 (print) |
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