IDT Releases Industry's First Integrated CMOS Chipset for 200G/400G SR Datacom Modules
In: Photonics Components & Subsystems, Jg. 17 (2018-09-01), Heft 9, S. 7-8
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Titel: |
IDT Releases Industry's First Integrated CMOS Chipset for 200G/400G SR Datacom Modules
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Zeitschrift: | Photonics Components & Subsystems, Jg. 17 (2018-09-01), Heft 9, S. 7-8 |
Veröffentlichung: | 2018 |
Medientyp: | serialPeriodical |
ISSN: | 1539-3623 (print) |
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