Reports from Anhui University Describe Recent Advances in Components Packaging and Manufacturing Technology (Millimeter-wave Active Integrated Semielliptic Cpw Slot Antenna With Ultrawideband Compensation of Ball Grid Array Interconnection)
In: Journal of Technology, 2022-02-22, S. 2648
Zeitungsartikel
Zugriff:
Titel: |
Reports from Anhui University Describe Recent Advances in Components Packaging and Manufacturing Technology (Millimeter-wave Active Integrated Semielliptic Cpw Slot Antenna With Ultrawideband Compensation of Ball Grid Array Interconnection)
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Zeitschrift: | Journal of Technology, 2022-02-22, S. 2648 |
Veröffentlichung: | 2022 |
Medientyp: | Zeitungsartikel |
ISSN: | 1944-1878 (print) |
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