Development of micromachined millimeter wave modules for wireless communication systems

This research discusses the design, fabrication, integration, and characterization of micromachined millimeter-wave components and a signal source for THz multiplier source using the deep reactive ion etching technique. A wide range of advanced micromachined millimeter-wave components are proposed and fully validated with the measurement. These micromachined millimeter-wave passives include: the W-band straight and meander waveguides, W-band three-pole filter, waveguide hybrid and power divider, a novel CPW-to-waveguide transition and filter, and a novel cavity resonator for 60-GHz reconfigurable applications. The proposed THz multiplier source is a broadband 900-GHz silicon micromachined two-anode frequency tripler with the state-of-the-art performance. The research results enable the silicon micromachining technique to build low-loss and low-cost millimeter-wave components and THz signal sources.