The FEM analysis and verification of reliability in assembly engineer of automobile IC–Case study of MCP delamination
2010
Hochschulschrift
Zugriff:
98
To fulfill the requirements for high quality, high structure and multi-function in Automobile industry, thus the IC with multi-function in multi-chips package structure is becoming the mainstream in Automobile application. By Multi Chip Package (MCP) assembly structure, it would provide the space saving and efficiency improvement to satisfy the automobile requirements. However, with the more and more complicated assembly structure, the IC package would sustain more outside stress. These complicated activities would cause the delamination problem and damage the inner device in its body. The research is simulated and studied the structure of multi-chip base on the Finite Element Method(FEM), and the Epoxy Molding Compound(EMC)is the only variable factor. The research provides the measurement of warpage and the force related variation under the cyclic loading at ambient temperature. In addition, the reliability test which are according to automobile industry standards measure the change of warpage at meantime. Finally it would be discussed the correlation between delamination and warpage by comparing with the simulated data of finite elements. Base on the experiences of previous research, most assembly engineering would focus on the simulation analysis, but few reliability and environment tests which accompany the simulation software to research are applied to product assembly on real automobile industry. How to develop a highly reliable IC package in automobile field and to achieve the optimum composing in cost and quality for the product competitiveness enhancement has become an important research topic.
Titel: |
The FEM analysis and verification of reliability in assembly engineer of automobile IC–Case study of MCP delamination
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Autor/in / Beteiligte Person: | Hung, Ying-Hao ; 洪英豪 |
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Veröffentlichung: | 2010 |
Medientyp: | Hochschulschrift |
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