Effect of Residual Stresses on De-bonding Problems for Flexible Electric Devices

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This research gives an introduction on AMOLED peeling technique. It includes the methods commonly used by the industry, and the FlexUP technique introduced by the ITRI. Through the introduction, it helps explain the technical difficulties associated with the FlexUP technique. This includes: delimitation, curl and corner phenomenon. Furthermore, FlexUP is a technique solely rely on breaking the de-bonding layers (DBL) in order to peel off the AMOLED, this leads to the mechanical behavior of de-bonding layers become one of the major focus in this research. The research exams the effect of residual stresses on FlexUP technique by using two different theories for mutual authentication. Theory one includes the effect of residual stresses in the energy release rate, while theory two provides the distribution of residual stresses along the thickness of the specimen. Both theories require information of the deflection of the cured specimen and the radius of curvature or curvature through the experimental measurements. The research establishes the FlexUP model through finite element simulation software Abaqus, and uses the cohesive element to analyze the mechanical behavior of the de-bonding layer (DBL). The traction separation law is used to realize the damage of the DBL. In additional to that, displacement control is used to simulate the peeling process. By following the above procedures, we can conclude the residual stresses do not affect the peak value of the peel force. Besides, we can discuss the effect of parameters on the energy release rate and the influence of the residual stresses on the interlaminar stresses.