On-Wafer Microwave De-Embedding Techniques
IntechOpen, 2017
Online
unknown
Wireless communication technology has kept evolving into higher frequency regime to take advantage of wider data bandwidth and higher speed performance. Successful RF circuit design requires accurate characterization of on-chip devices. This greatly relies on robust de-embedding technique to completely remove surrounding parasitics of pad and interconnects that connect device to measurement probes. Complex interaction of fixture parasitic at high frequency has imposed extreme challenges to de-embedding particularly for lossy complementary metal oxide semiconductor (CMOS) device. A generalized network de-embedding technique that avoids any inaccurate lumped and transmission line assumptions on the pad and interconnects of the test structure is presented. The de-embedding strategy has been validated by producing negligible de-embedding error (
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On-Wafer Microwave De-Embedding Techniques
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Autor/in / Beteiligte Person: | Loo, Xi Sung |
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Veröffentlichung: | IntechOpen, 2017 |
Medientyp: | unknown |
ISBN: | 978-953-51-2867-0 (print) ; 953-51-2867-1 (print) |
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