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The present invention relates generally to a High Efficiency MEMS Micro-Vibrational Energy Harvester (μVEH) having a thick beam bimorph architecture. The disclosed architecture is capable of producing a voltage of sufficient magnitude such that the requirement to connect a plurality of harvesters in series to produce an adequate voltage magnitude is eliminated.

Titel:	High-Efficiency MEMS Micro-Vibrational Energy Harvester And Process For Manufacturing Same
Autor/in / Beteiligte Person:	Boysel, Robert Mark
Link:	View record in USPTO Patent Applications (Volltext)
Veröffentlichung:	2011
Medientyp:	Patent
Sonstiges:	Nachgewiesen in: USPTO Patent Applications Sprachen: English Document Number: 20110210554 Publication Date: September 1, 2011 Appl. No: 13/030182 Application Filed: February 18, 2011 Assignees: MCB CLEAN ROOM SOLUTIONS, LLC (Honeoye Falls, NY, US) Claim: 1. A vibrational energy harvesting device comprising: a cantilever having a first end, a second end and a core having, a first planar surface and a second planar surface, the core being fabricated as two plate layers and bonded together; a first piezoelectric stack having a piezoelectric material placed between a first conductive layer and a second conductive layer and attached to the first planar surface of said core; a second piezoelectric stack having a piezoelectric material placed between a first conductive layer and a second conductive layer and attached to the second planar surface of said core; and a casing wherein the first end of the cantilever is joined to the casing and the second end is free to move. Claim: 2. The vibrational energy harvesting device as recited in claim 1, further comprising a proof mass mechanically coupled to the second end of the cantilever. Claim: 3. The vibrational energy harvesting device as recited in claim 1, further comprising an electrical contact operatively coupled to said first piezoelectric stack. Claim: 4. The vibrational energy harvesting device as recited in claim 1, further comprising an electrical contact operatively coupled to said second piezoelectric stack. Claim: 5. The vibrational energy harvesting device as recited in claim 1, wherein said core is gold. Claim: 6. The vibrational energy harvesting device as recited in claim 1, wherein said core is copper. Claim: 7. The vibrational energy harvesting device as recited in claim 1, wherein said core is nickel. Claim: 8. The vibrational energy harvesting device as recited in claim 1, wherein said piezoelectric material is aluminum nitride. Claim: 9. The vibrational energy harvesting device as recited in claim 1, wherein said casing is silicon. Claim: 10. The vibrational energy harvesting device as recited in claim 1, wherein said cantilever is rectangular. Claim: 11. The vibrational energy harvesting device as recited in claim 1, wherein said cantilever is trapezoidal. Claim: 12. The vibrational energy harvesting device as recited in claim 1, further comprising a first cap and a second cap. Claim: 13. The vibrational energy harvesting device as recited in claim 12, further comprising an inert gas contained within the first cap and the second cap. Claim: 14. The vibrational energy harvesting device as recited in claim 12, further comprising a gas at a pressure less than one atmosphere contained within the first cap and the second cap. Claim: 15. A chipset having a substrate and a vibrational energy harvesting device comprising a cantilever having a first end, a second end and a core having a first planar surface and a second planar surface, the core being fabricated as two plate layers and bonded together; a first piezoelectric stack having a piezoelectric material placed between a first conductive layer and a second conductive layer and attached to the first planar surface of said core; a second piezoelectric stack having a piezoelectric material placed between a first conductive layer and a second conductive layer and attached to the second planar surface of said core; and a casing wherein the first end of the cantilever is joined to the casing and the second end is free to move. Claim: 16. The chipset as recited in claim 15 wherein the substrate is silicon. Claim: 17. The chipset as recited in claim 15, further comprising a proof mass mechanically coupled to the second end of the cantilever. Claim: 18. A method for fabricating a vibrational energy harvesting device comprising the steps of: creating a first wafer set and a second wafer set by forming an oxide layer on a substrate; depositing a first and second piezoelectric stack on the substrate; patterning a first electrode; patterning a piezoelectric material; patterning a second electrode; depositing bond pads; depositing a contact layer; etching contacts in said contact layer; patterning a core layer; aligning the plate layer of the first wafer set with the plate layer of the second wafer set; bonding said first wafer set to said second wafer set; patterning a resulting vibrational energy harvesting device; and singulating and releasing the resulting vibrational energy harvesting device. Claim: 19. The method as recited in claim 18, wherein said core layer is formed by the steps of depositing a seed layer and plating said seed layer. Claim: 20. The method as recited in claim 18, further comprising the step of capping the resulting vibrational energy harvesting device. Claim: 21. The method as recited in claim 18, further comprising the step of wire bonding the resulting vibrational energy harvesting device. Claim: 22. The method as recited in claim 18, further comprising the step of packaging the resulting vibrational energy harvesting device. Claim: 23. An energy harvesting circuit comprising: a vibrational energy harvesting device in accordance with claim 1; a power rectification circuit for converting oscillatory current electric power to direct current electric power; and an energy storage device. Claim: 24. The energy harvesting circuit as recited in claim 23 wherein the energy storage device is a battery. Claim: 25. The energy harvesting circuit as recited in claim 23 wherein the energy storage device is a capacitor. Current U.S. Class: 290/50 Current International Class: 03; 02; 01

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High-Efficiency MEMS Micro-Vibrational Energy Harvester And Process For Manufacturing Same