Einzeltreffer — DigiBib

A micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes micro-spray heads disposed about a probe head. The spray heads and probe head are disposed in a sealed manner inside a spray chamber that, during operation, is urged in a sealing manner onto a sealing plate holding the integrated circuit under test. The atomized mist cools the integrated circuit and then condenses on the spray chamber wall. The condensed fluid is pumped out of the chamber and is circulated in a chiller, so as to be re-circulated and injected again into the micro-spray heads. The pressure inside the spray chamber may be controlled to provide a desired boiling point.

Titel:	SPRAY COOLING THERMAL MANAGEMENT SYSTEM AND METHOD FOR SEMICONDUCTOR PROBING, DIAGNOSTICS, AND FAILURE ANALYSIS
Autor/in / Beteiligte Person:	Cader, Tahir ; Tilton, Charles Lester ; Tolman, Benjamin Hewett ; Wos, George Joseph ; Roberts, Alan Brent ; Wong, Thomas ; Frank, Jonathan D.
Link:	View record in USPTO Patent Applications (Volltext)
Veröffentlichung:	2012
Medientyp:	Patent
Sonstiges:	Nachgewiesen in: USPTO Patent Applications Sprachen: English Document Number: 20120007623 Publication Date: January 12, 2012 Appl. No: 13/241100 Application Filed: September 22, 2011 Assignees: DCG SYSTEMS, INC. (Fremont, CA, US) Claim: 1. A method for testing of a device under test (DUT), the method comprising: mounting the DUT onto a test bench; mounting a DUT retention frame with a seal plate about the DUT; coupling a cooling head to the seal plate; electrically coupling the IC to a tester; providing a test signal from the tester to the IC; providing cooling fluid to the cooling head so as to spray at least a portion of the IC with the cooling fluid to control the temperature of the IC; and collecting light from the IC using optical system. Claim: 2. The method of claim 1, wherein said collecting light comprises coupling an imaging system to said IC and preventing said cooling fluid from entering an optical axis of the imaging system. Claim: 3. The method of claim 1, wherein said collecting light comprises contacting said IC with a solid immersion lens (SIL) and providing a shield about said SIL. Claim: 4. The method of claim 1, wherein spraying comprises applying the cooling fluid to a plurality of nozzles. Claim: 5. The method of claim 1, wherein spraying comprises applying the cooling fluid to a plurality of atomizers. Claim: 6. The method of claim 1, wherein the spraying is designed to cause at least part of the cooling fluid to evaporate upon contacting the IC. Claim: 7. The method of claim 1, wherein collecting light from the IC comprises detecting optical emissions caused by the response of the IC to the test signal. Claim: 8. The method of claim 1, further comprising preventing the cooling fluid from reaching contact pins of the DUT. Claim: 9. The method of claim 1, further comprising enabling cooling of the DUT from the contact pin side by allowing cooling liquid to reach the contact pins of the DUT. Claim: 10. The method of claim 9, wherein allowing cooling liquid to reach the contact pins of the DUT comprises applying hydrofluoroether of perfluorocarbon cooling liquid to the contact pins of the DUT. Claim: 11. The method of claim 9, wherein allowing cooling liquid to reach the contact pins of the DUT comprises allowing the cooling fluid to reach the contact pins of the DUT. Claim: 12. The method of claim 1, further comprising applying an NIR transparent cover plate to the DUT. Claim: 13. The method of claim 1, further comprising affixing the cooling head to a translation stage. Claim: 14. The method of claim 1, mounting a DUT retention frame with a seal plate about the DUT comprises forming a hermetic seal between the cooling head and the seal plate. Claim: 15. The method of claim 1, mounting a DUT retention frame with a seal plate about the DUT comprises forming a non-hermetic seal between the cooling head and the seal plate. Claim: 16. The method of claim 1, further comprising using a shield to prevent mist from entering optical axis of the optical system. Claim: 17. The method of claim 1, further comprising arranging a plurality of nozzles in the cooling head. Claim: 18. The method of claim 17, wherein arranging a plurality of nozzles comprises dividing the plurality of nozzles to a plurality of banks. Claim: 19. The method of claim 17, wherein arranging a plurality of nozzles comprises arranging the nozzles circularly about the optical system. Claim: 20. The method of claim 18, further comprising applying the cooling fluid to the plurality of banks, wherein at least one of the banks receives the cooling fluid at one of: different flow rate, different cooling fluid, or different temperature. Current U.S. Class: 32475/008 Current International Class: 01

Klicken Sie ein Format an und speichern Sie dann die Daten oder geben Sie eine Empfänger-Adresse ein und lassen Sie sich per Email zusenden.

BibTeX Citavi, JabRef, u.a.
(Literaturverwaltung)

PDF kein Volltext!
(Merkzettel, Notizen)

RIS Endnote, Citavi u.a.
(Literaturverwaltung)

MODS
(XML zur Weiterverarbeitung)

oder

Wählen Sie das für Sie passende Zitationsformat und kopieren Sie es dann in die Zwischenablage, lassen es sich per Mail zusenden oder speichern es als PDF-Datei.

Gewünschter Zitations-Stil:

oder

Bitte prüfen Sie, ob die Zitation formal korrekt ist, bevor Sie sie in einer Arbeit verwenden. Benutzen Sie gegebenenfalls den "Exportieren"-Dialog, wenn Sie ein Literaturverwaltungsprogramm verwenden und die Zitat-Angaben selbst formatieren wollen.

SPRAY COOLING THERMAL MANAGEMENT SYSTEM AND METHOD FOR SEMICONDUCTOR PROBING, DIAGNOSTICS, AND FAILURE ANALYSIS