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A multi junction CPV package device comprising: an anode carrier plate; a solar cell array adapted to be electrically connected with wire bonds to the anode carrier plate, the solar cell array comprising an active area; an SOE positionable on the solar cell array and the anode, the SOE forming a first aperture with a wall around at least a portion of the active area and a second aperture around at least a portion of the anode carrier plate, the wall of the first aperture comprising a UV-resistant material; and a cathode plate having an electrical insulation from the anode carrier plate and the cathode plate having a first surface having a thermal connection to the solar cell and a second surface opposed to the first surface, wherein the solar cell and the cathode plate have a thermal connection and the second surface is adapted to be surface-mounted to a PCB.

Titel:	MULTI-JUNCTION CPV PACKAGE AND METHOD
Link:	View record in USPTO Patent Applications (Volltext)
Veröffentlichung:	2014
Medientyp:	Patent
Sonstiges:	Nachgewiesen in: USPTO Patent Applications Sprachen: English Document Number: 20140116496 Publication Date: May 1, 2014 Appl. No: 13/665948 Application Filed: November 01, 2012 Claim: 1. A concentrated photovoltaic (CPV) package device having a bottom surface, comprising: an anode carrier plate comprising part of the bottom surface; a solar cell electrically connected with wire bonds to the anode carrier plate, the solar cell comprising an active area; a secondary optical element (SOE) positionable on the solar cell and the anode, the SOE configured as a first aperture with a wall around at least a portion of the active area and a second aperture around at least a portion of the anode carrier plate, the wall of the first aperture comprising at least one UV-resistant and dielectric material chosen from the list including: silicone; ceramic; glass; silica; silicon; and glass-fiber, a cathode plate having an electrical insulation from the anode carrier plate and the cathode plate having a first surface having a thermal and an electrical connection to the solar cell and a second surface opposed to the first surface, the second surface comprising part of the bottom surface; and a plurality of bonding pads configured on the bottom surface, the bonding pads surface-mountable directly to a printed circuit board (PCB) by means of surface mounting technology (SMT). Claim: 2. The package device of claim 1, wherein the solar cell is a CPV cell type chosen from at least one in the list including: silicon-based; single junction; dual-junction; multi-junction; and III-V-based. Claim: 3. The package device of claim 1, wherein the bonding pads are surface-mountable directly to the PCB by means of reflow soldering, and the package device has a mechanical, thermal, and electrical bond to the PCB. Claim: 4. The package device of claim 3, wherein the PCB is configured as a heat sink. Claim: 5. The package device of claim 1, wherein the anode carrier plate is further configured as a lens holder for the SOE. Claim: 6. The package device of claim 1, further comprising an optical encapsulation cavity positionable above the solar cell and beneath the SOE. Claim: 7. The package device of claim 1, further comprising an insulated housing adapted to protect the solar cell from the environment. Claim: 8. The package device of claim 1, wherein the anode carrier plate, the solar cell array, the SOE, and the cathode plate have substantially equal coefficients of thermal expansion. Claim: 9. (canceled) Claim: 10. A method of fabricating a concentrated photovoltaic (CPV) package device, having a bottom surface, comprising the steps of: taking an anode carrier plate, the carrier plate forming part of the bottom surface; connecting a solar cell electrically to the anode carrier plate using wire bonds, the solar cell comprising an active area; positioning a secondary optical element (SOE) on the solar cell and the anode, the SOE forming a first aperture with a wall around at least a portion of the active area and a second aperture around at least a portion of the anode carrier plate, the wall of the first aperture comprising a UV-resistant material; configuring a cathode plate electrically insulated from the anode carrier plate and having a first surface thermally and electrically connected to the solar cell and a second surface opposed to the first surface, the second surface forming part of the bottom surface; and surface-mounting the bottom surface to a printed circuit board (PCB). Claim: 11. The method of claim 10, whereby the solar cell is a CPV cell type chosen from at least one in the list including: silicon-based; single junction; dual-junction; multi-junction; and III-V-based. Claim: 12-13. (canceled) Current U.S. Class: 136/246 Current International Class: 01; 01

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MULTI-JUNCTION CPV PACKAGE AND METHOD