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Process for producing DCB substrates having in each case at least one ceramic layer which is essentially made up of aluminium nitride (AlN) and is provided on at least one surface side with an intermediate layer which is essentially made up of aluminium oxide and also has at least one metallization formed by a metal layer or metal foil on the intermediate layer

Titel:	PROCESS FOR PRODUCING DCB SUBSTRATES
Link:	View record in USPTO Patent Applications (Volltext)
Veröffentlichung:	2014
Medientyp:	Patent
Sonstiges:	Nachgewiesen in: USPTO Patent Applications Sprachen: English Document Number: 20140338162 Publication Date: November 20, 2014 Appl. No: 14/368968 Application Filed: December 27, 2012 Claim: 1. A process for producing DCB substrates having at least one ceramic layer (2) consisting essentially of aluminium nitride (ALN), wherein at least one surface side of the at least one ceramic layer is has an intermediate layer consisting essentially of aluminium oxide Al2O3), and at least one metallisation formed by a metal layer on the intermediate layer, wherein a green foil is produced from the aluminium nitride and sintering agents by casting, calendering and/or compacting, and a blank ceramic layer is thereby produced from the green foil by sintering, and wherein the intermediate layer is thereby produced on the at least one surface side of the at least one ceramic layer, and the metal layer is then bonded with the intermediate layer by DCB bonding, wherein before production of the intermediate layer on the surface side of the at least one ceramic layer, a surface layer resulting from the sintering containing impurities and/or reaction products is removed therefrom. Claim: 2. The process according to claim 1, whereby removal of the surface layer is carried out by brushing, grinding, lapping, sand blasting, or pressure blasting. Claim: 3. The process according to claim 1, wherein removal of the surface layer is carried out by chemical treatment with an alkaline aqueous solution having a pH value greater than 10. Claim: 4. The process according to claim 3, wherein the surface layer is removed at a treatment temperature range between 20° C. and 100° C. Claim: 5. The process according to claim 3, wherein the surface layer (6) is removed by the chemical treatment with, a 5% caustic soda solution and/or by the chemical treatment with a potassium hydroxide (KOH) and/or sodium carbonate (Na2CO3). Claim: 6. The process according to claim 1, wherein the surface layer is removed by application of heat in a liquid and/or steam under pressure in an autoclave at temperatures up to 300° C. Claim: 7. The process according to claim 1, wherein a thin layer of copper, copper oxide, or of at least one other copper-containing compound is applied to the at least one surface side of the ceramic layer before the intermediate layer is created, and the intermediate layer is produced subsequently by thermal oxidation. Claim: 8. The process according to claim 7, wherein the thermal oxidation continues until a layer thickness in the range between 0.5 μm and 10 μm has been reached for the intermediate layer. Claim: 9. The process according to claim 1, wherein the mechanical and chemical treatments for removing the surface layer are carried out at least partly concurrently or consecutively. Claim: 10. The process according to claim 7, wherein the thin layer of copper, copper oxide or of the at least one copper-containing compound is applied by immersing the at least one ceramic layer in an aqueous solution containing from 0.005 to 2.0 Mol/l copper ions. Claim: 11. The process according to claim 7, wherein the thin layer of copper, copper oxide or of the at least one copper-containing compound is applied by sputtering, by chemical vapour deposition and/or by chemical precipitation. Claim: 12. The process according to claim 1, wherein the intermediate layer is created by heating the at least one ceramic layer to a temperature in the range between 800° C. and 1450° C. in air or in an oxygen-containing atmosphere with an oxygen component between 10% and 90%. Claim: 13. A process for producing DCB substrates comprising the steps of: 1) placing at least one oxidised metal foil made from copper or a copper alloy on top of at least one surface side of a cleaned aluminium nitride (AlN) ceramic layer; 2) heating the at least one oxidised metal foil and the cleaned aluminium nitride (AlN) ceramic layer to a temperature between 400° C. and 1083° C.; 3) removing the at least one oxidised metal foil, after cooling the at least one oxidised metal foil and the cleaned aluminium nitride (AlN) ceramic layer; 4) oxidising the cleaned aluminium nitride (AlN) ceramic layer at a temperature of 850° C.-1450° C. in an oxygen-containing atmosphere to produce an intermediate layer on at least one surface side of the cleaned aluminium nitride (AlN) ceramic layer; and 5) DCB bonding the at least one oxidised metal foil with the at least one surface side of the cleaned aluminium nitride (AlN) ceramic layer. Claim: 14. A process for producing DCB substrates, comprising the steps of: 1) oxidising the a cleaned aluminium nitride (AlN) ceramic layer at a temperature from 800° C.-1450° C to form an oxidised ceramic layer; 2) DCB bonding at least one metal foil made from copper or a copper alloy on at least one surface side of the oxidised ceramic layer; 3) removing the at least one metal foil by etching; 4) oxidising the ceramic layer again, at a temperature from 800° C.-1450° C; and 5) DCB bonding the at least one metal foil on at least one surface side of the ceramic layer. Current U.S. Class: 29/173 Current International Class: 05; 05

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PROCESS FOR PRODUCING DCB SUBSTRATES