Einzeltreffer — DigiBib

This disclosure relates to systems and apparatuses for the cleaning of HDP chambers, and more specifically, for remote plasma source (“RPS”) systems used for the generation and delivery of cleaning radicals to the interior of such chambers for the purposes of reacting with and removing materials deposited therein during the chambers' normal operation, wherein the plasma source and the power supply of the RPS system are decoupled from one another, the form factor of the plasma source is such that it may be mounted in immediate proximity to the target chamber, and wherein the plasma source uses variable capacitors in order to tune the RF signals it generates to the impedance of the conductive coil, such as may be due to changes in gas pressures inside of the system, so that the RF load in the coil may be balanced in near-real time.

Titel:	COMPACT REMOTE PLASMA SOURCE FOR HDP CVD CHAMBERS
Link:	View record in USPTO Patent Applications (Volltext)
Veröffentlichung:	2024
Medientyp:	Patent
Sonstiges:	Nachgewiesen in: USPTO Patent Applications Sprachen: English Document Number: 20240087852 Publication Date: March 14, 2024 Appl. No: 18/244112 Application Filed: September 08, 2023 Assignees: Advanced Refurbishment Technologies LLC d/b/a ARTSemi LLC (Austin, TX, US) Claim: 1. A plasma source for an RPS system, comprising: 1.1. a conductive coil; 1.2. an inlet configured to receive a gas; 1.3. an outlet configured to transmit radicalized cleaning gases to a reaction chamber; 1.4. a confinement tube placing the inlet and the outlet in fluid communication, and which passes through the conductive coil therebetween; 1.5. an RF input configured to receive RF power; 1.6. a variable capacitor electrically connected to the RF input and to a first end of the conductive coil, the variable capacitor configured to receive RF power form the RF input and to output an RF signal to the conductive coil; 1.7. a capacitor electrically connected to the RF input and to a second end of the conductive coil and to ground; and 1.8. a match control system comprising a phase mag pickup, and configured to: 1.8.1. monitor an impedance of the conductive coil in near-real time; 1.8.2. determine a matching value calculated to balance an RF load in the conductive coil generated by the RF signal at a desired frequency based on the impedance; and 1.8.3. modify a capacitance of the variable capacitor based on the matching value. Claim: 2. The plasma source of claim 1, wherein the RF load is approximately 50 ohms, and wherein the desired frequency is approximately 13.56 mHz. Claim: 3. The plasma source of claim 1, wherein the outlet is further configured to connect to a chamber and wherein a distance from the center of the conductive coil to an end of the outlet is less than 10 inches. Claim: 4. The plasma source of claim 1, wherein said system further comprises: a power source configured to operate in a location remote from the plasma source and to generate and supply RF power to the RF input via a suitable means of power transmission. Claim: 5. The plasma source of claim 1, further comprising: a cooling sleeve disposed about a length of the confinement tube and inside of the conductive coil, wherein an outer surface of the confinement tube and an inner surface of the cooling sleeve define a volume through which a cooling fluid may be circulated. Claim: 6. The plasma source of claim 5, wherein at least one of confinement tube and the cooling sleeve comprise an electrical insulator, and wherein the volume is electrically insulated from materials outside of the volume. Claim: 7. The plasma source of claim 1, wherein the phase mag pickup is configured to monitor the impedance of the conductive coil in near-real time via a reflected RF signal. Claim: 8. The plasma source of claim 1, wherein the conductive coil comprises between 17 and 25 turns. Claim: 9. The plasma source of claim 1, wherein the capacitor comprises a fixed capacitor comprising a capacitance between approximately 10 and 200 picofarads. Claim: 10. The plasma source of claim 1, wherein the variable capacitor comprises a capacitance that may be varied between approximately 10 and 500 picofarads and is connected between RF input and ground. Claim: 11. The plasma source of claim 1, further comprising a second variable capacitor comprising a capacitance that may be varied between approximately 10 and 200 picofarads, electrically connected to the RF input and to the first end of the conductive coil. Claim: 12. An RPS system plasma source comprising: 12.1. an RF input configured to receive RF power; 12.2. an inductively coupled coil; 12.3. a variable shunt capacitor electrically connected between the RF input and case ground, and configured to transmit received RF power to case ground; 12.4. a variable tuning capacitor electrically connected between the RF input and a first end of the inductively coupled coil, and configured to transmit received RF power to said first end of the inductively coupled coil; 12.5. a fixed capacitor electrically connected between a second end of the inductively coupled coil and case ground, and configured to transmit RF power received from the inductively coupled coil to case ground; and 12.6. a match control system configured to balance an RF load in the inductively coupled coil at a desired frequency in in near-real time by monitoring a reflected RF signal, and to control a capacitance of at least one of the variable shunt capacitor and the variable tuning capacitor based on one or more tuning values calculated from the reflected RF signal. Claim: 13. The RPS system plasma source of claim 12, wherein the RF load comprises approximately 50 ohms, and the desired frequency comprises approximately 13.56 mHZ. Claim: 14. The RPS system plasma source of claim 12, further comprising an RF power supply configured to be located remotely from the RPS system plasma source and to generate and supply RF power to the RF input. Claim: 15. The RPS system plasma source of claim 12, wherein the RPS system plasma source is sized and configured such that an outlet of the RPS system plasma source is within 10 inches of the bottom of a HDP CVD chamber. Claim: 16. The RPS system plasma source of claim 12, further comprising: 16.1. an inlet for receiving an input gas; 16.2. an outlet for transmission of radicalized cleaning gases from the plasma generation system to a chamber; 16.3. a confinement tube placing the inlet and the outlet in fluid communication, and passing through the inductively coupled coil between the inlet and the outlet; and 16.4. a cooling sleeve disposed inside of the inductively coupled coil and surrounding a length of the confinement tube, the cooling sleeve configured to receive a cooling fluid in a volume between the cooling sleeve and the confinement tube. Claim: 17. The RPS system plasma source of claim 16, wherein the volume is electrically insulated from components of the plasma generation system located outside of the volume. Claim: 18. A method of dynamically tuning an RF load in a coil of an RPS system plasma source comprising an RF input, a conductive coil, and a variable capacitor electrically connected therebetween, the method comprising the steps of: 18.1. receiving RF power at the RF input; 18.2. inputting an RF signal into the conductive coil through the variable capacitor; 18.3. measuring an impedance of the conductive coil based on reflected RF power; 18.4. determining a matching value required to balance an RF load in the conductive coil based on the impedance; 18.5. tuning a capacitance of the variable capacitor based on the matching value; and 18.6. inputting the RF signal into the conductive coil through the tuned variable capacitor. Claim: 19. The method of claim 18, wherein a RF load of substantially 50 ohms at a frequency of substantially 13.56 mHz is generated in the conductive coil responsive to step 18.7. Claim: 20. The method of claim 18, wherein steps 18.3-18.6 are iterated in near-real time. Current International Class: 01

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COMPACT REMOTE PLASMA SOURCE FOR HDP CVD CHAMBERS