Einzeltreffer — DigiBib

A CMOS image sensor includes PDAF pixels distributed in an array of image pixels in plan view. Each PDAF pixel includes m×m binned photodiodes, a PDAF color filter overlying the binned photodiodes and laterally surrounded by a first isolation structure, and a PDAF micro-lens overlying the PDAF color filter. A first horizontal distance between a center of the PDAF color filter and a center of the binned photodiodes varies depending on a location of the PDAF pixel in plan view in the CMOS image sensor. Additionally, the first isolation structure includes a first low-n dielectric grid, a second low-n dielectric grid underlying the first low-n dielectric grid, and a metal grid enclosed by the second low-n dielectric grid. The second low-n dielectric grid includes a filler dielectric material different from a second low-n dielectric grid material. Thus, quantum efficiency and uniformity of the CMOS image sensor are improved.

Titel:	CMOS IMAGE SENSOR
Link:	View record in USPTO Patent Applications (Volltext)
Veröffentlichung:	2024
Medientyp:	Patent
Sonstiges:	Nachgewiesen in: USPTO Patent Applications Sprachen: English Document Number: 20240105750 Publication Date: March 28, 2024 Appl. No: 18/110843 Application Filed: February 16, 2023 Claim: 1. A CMOS image sensor comprising: a photodiode array in a photodiode layer disposed in a semiconductor substrate; a color filter array in a color filter layer overlying the photodiode array; a micro-lens array in a micro-lens layer overlying the color filter array; and a first isolation structure disposed in the color filter layer laterally separating adjacent color filters, and comprising a first low refractive index (low-n) dielectric grid of a first dielectric material, a second low-n dielectric grid of a second dielectric material underlying the first low-n dielectric grid, and a metal grid at least partially enclosed by the second low-n dielectric grid, wherein the second low-n dielectric grid comprises a filler dielectric material different from and mixed with the second dielectric material, wherein a total volume of the filler dielectric material is less than a total volume of the second dielectric material in the second low-n dielectric grid, and wherein a refractive index of the filler dielectric material is different from a refractive index of the second dielectric material. Claim: 2. The CMOS image sensor of claim 1, wherein the filler dielectric material comprises an oxide material, and wherein the filler dielectric material is randomly shaped. Claim: 3. The CMOS image sensor of claim 1, wherein refractive indexes of the first and the second low-n dielectric grids are less than the refractive index of the color filter cells, and wherein the refractive indexes of the first and the second low-n dielectric grids and the filler dielectric material are in a range greater than 1 and less than 1.5. Claim: 4. The CMOS image sensor of claim 1, wherein the first low-n dielectric grid comprises another filler dielectric material different from and mixed with the first dielectric material, wherein a total volume of the another filler dielectric material is less than a total volume of the first dielectric material in the first low-n dielectric grid, and wherein a refractive index of the another filler dielectric material is different from a refractive index of the first dielectric material. Claim: 5. The CMOS image sensor of claim 1, wherein a first width of the first low-n dielectric grid is less than a second width of the second low-n dielectric grid. Claim: 6. The CMOS image sensor of claim 1, wherein the metal grid is at least partially wrapped by a dielectric etch stop film separating the metal grid from the second low-n dielectric grid, and wherein the metal grid is made of a metal material or a metal alloy material. Claim: 7. The CMOS image sensor of claim 1, further comprising a separation layer separating the micro-lens layer and the color filter layer. Claim: 8. The CMOS image sensor of claim 1, further comprising a second isolation structure disposed in the semiconductor substrate laterally separating adjacent photodiodes. Claim: 9. The CMOS image sensor of claim 8, wherein the second isolation structure comprises a deep trench isolation (DTI) grid having a needle shaped or rectangular profile. Claim: 10. The CMOS image sensor of claim 1, further comprising a plurality of phase detection auto-focusing (PDAF) pixels, wherein each PDAF pixel comprises: m×m binned photodiodes, m being an integer equal to or greater than 2, a PDAF color filter disposed in the color filter layer and overlying the 2×2 binned photodiodes, and a PDAF micro-lens disposed in the micro-lens layer and overlying the PDAF color filter, wherein the first isolation structure laterally separates the PDAF color filter from adjacent color filters of the color filter array. Claim: 11. A CMOS image sensor, comprising: an array of image pixels, wherein each image pixel comprises: a photodiode surrounded by a photodiode isolation structure in a photodiode layer, a color filter overlying the photodiode and surrounded by a color filter isolation structure in a color filter layer, and a micro-lens overlying the color filter in a micro-lens layer; and a plurality of phase detection auto-focusing (PDAF) pixels distributed in the array of image pixels in plan view, wherein each PDAF pixel comprises: m×m binned photodiodes in the photodiode layer, m being an integer equal to or greater than 2, a PDAF color filter overlying the m×m binned photodiodes and surrounded by the color filter isolation structure in the color filter layer, and a PDAF micro-lens overlying the PDAF color filter, wherein a first horizontal distance between a center of gravity of the PDAF color filter (40B) and a center of gravity of the m×m binned photodiodes varies depending on a location of the PDAF pixel in the CMOS image sensor. Claim: 12. The CMOS image sensor of claim 11, wherein in an edge region of the CMOS image sensor, the first horizontal distance between the center of gravity of the PDAF color filter and the center of gravity of the 2×2 binned photodiodes gradually increases in a first direction in plan view from a center of the CMOS image sensor to an edge of the edge region. Claim: 13. The CMOS image sensor of claim 11, wherein a second horizontal distance between a center of gravity of the PDAF micro-lens and the center of gravity of the PDAF color filter in horizontal plan view varies depending on the location of the PDAF pixel in the CMOS image sensor. Claim: 14. The CMOS image sensor of claim 13, wherein in an edge region of the CMOS image sensor, the second horizontal distance the center of gravity of the PDAF micro-lens and the center of gravity of the PDAF color filter gradually increases in a first direction in plan view from a center of the CMOS image sensor to an edge of the edge region. Claim: 15. The CMOS image sensor of claim 11, wherein a ratio of a photodiode coverage by the plurality of PDAF pixels to a total photodiode coverage by the CMOS image sensor is in a range from about 4% to about 10%. Claim: 16. A CMOS image sensor comprising: a plurality of phase detection auto-focusing (PDAF) pixels distributed in an array of image pixels in plan view, wherein each PDAF pixel comprises: m×m binned photodiodes in a photodiode layer, m being an integer equal to or greater than 2, a PDAF color filter overlying the m×m binned photodiodes and surrounded by a color filter isolation structure in a color filter layer, and a PDAF micro-lens overlying the PDAF color filter in a micro-lens layer, wherein a first horizontal distance between a center of gravity of the PDAF color filter and a center of gravity of the m×m binned photodiodes varies depending on a location of the PDAF pixel in the CMOS image sensor. Claim: 17. The CMOS image sensor of claim 16, wherein in an edge region of the CMOS image sensor, the first horizontal distance between the center of gravity of the PDAF color filter and the center of gravity of the 2×2 binned photodiodes gradually increases in a first direction in plan view from a center of the CMOS image sensor to an edge of the edge region. Claim: 18. The CMOS image sensor of claim 16, wherein a second horizontal distance between a center of gravity of the PDAF micro-lens and the center of gravity of the PDAF color filter in horizontal plan view varies depending on the location of the PDAF pixel in the CMOS image sensor. Claim: 19. The CMOS image sensor of claim 18, wherein in an edge region of the CMOS image sensor, the second horizontal distance the center of gravity of the PDAF micro-lens and the center of gravity of the PDAF color filter gradually increases in a first direction in plan view from a center of the CMOS image sensor to an edge of the edge region. Claim: 20. The CMOS image sensor of claim 16, wherein a ratio of a photodiode coverage by the plurality of PDAF pixels to a total photodiode coverage by the CMOS image sensor is in a range from about 4% to about 10%. Current International Class: 01

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CMOS IMAGE SENSOR