Einzeltreffer — DigiBib

The present invention provides a printed wiring board with a built-in semiconductor element in which an insufficient or excessive amount of filled sealing material does not affect excellent adhesion of the printed wiring board to an overlying wiring board. The printed wiring board with a built-in semiconductor element comprises a built-in semiconductor element, in which at least the lower surface, the upper surface, or the side surface of the semiconductor element is covered with an insulating film, and an insulating layer is provided in the side and upper portions of the semiconductor element. There is also provided a process for producing a printed wiring board with a built-in semiconductor element, comprising the steps of mounting a semiconductor element on a base substrate and covering at least the lower surface, the upper surface, or the side surface of the semiconductor element with an insulating film, disposing and stacking a semicured insulating sheet in the side portion of the semiconductor element, and disposing and stacking a semicured insulating sheet in the upper portion of the semiconductor element.

Titel:	Printed wiring board with built-in semiconductor element, and process for producing the same
Autor/in / Beteiligte Person:	Yoshino, Yutaka ; Shirai, Takahiro ; Kadono, Shinji ; Kawamoto, Mineo ; Enomoto, Minoru ; Goto, Masakatsu ; Araki, Makoto ; Toda, Naoki
Link:	View record in USPTO Patent Grants (Volltext)
Veröffentlichung:	2011
Medientyp:	Patent
Sonstiges:	Nachgewiesen in: USPTO Patent Grants Sprachen: English Patent Number: 7,894,200 Publication Date: February 22, 2011 Appl. No: 11/913559 Application Filed: November 28, 2006 Assignees: CMK Corporation (Tokyo, JP), Renesas Eastern Japan Semiconductor, Inc. (Tokyo, JP) Claim: 1. A printed wiring board, comprising: a built-in semiconductor element, a protective film formed on a semiconductor element-mounted surface of a base substrate to which the built-in semiconductor element is connected to protect the semiconductor element-mounted surface excepting a mounting pad, a lower surface of the built-in semiconductor element covered with a first insulating film formed by filling a sealing material, and a gap around the built-in semiconductor element and the first insulating film filled with a second insulating film formed of an insulating resin melted from an insulating layer that is provided in side and upper portions of the built-in semiconductor element. Claim: 2. The printed wiring board according to claim 1 , wherein a side insulating layer is formed of a prepreg material or a build-up base material. Claim: 3. The printed wiring board according to claim 1 , wherein an upper insulating layer is formed of a prepreg material or a build-up base material. Claim: 4. The printed wiring board according to claim 1 , wherein a linear expansion coefficient of the first insulating film is different from that of the second insulating film. Claim: 5. The printed wiring board according to claim 1 , wherein a passive component is disposed under the built-in semiconductor element. Claim: 6. The printed wiring board according to claim 5 , wherein the passive component is connected to the built-in semiconductor element through an interlayer connection via. Claim: 7. The printed wiring board according to claim 5 , wherein the passive component is any one of a resistor, a capacitor, a coil, and an inductor, or a combination of two or more thereof. Current U.S. Class: 361/761 Patent References Cited: 7307852 December 2007 Inagaki et al. ; 7435910 October 2008 Sakamoto et al. ; 2003/0090883 May 2003 Asahi et al. ; 2003/0150641 August 2003 Kinayman et al. ; 2003/0183920 October 2003 Goodrich et al. ; 2005/0157478 July 2005 Inagaki et al. ; 2006/0003495 January 2006 Sunohara et al. ; 2006/0087020 April 2006 Hirano et al. ; 2001 44641 February 2001 ; 2002 344146 November 2002 ; 2005 39094 February 2005 Assistant Examiner: Nguyen, Hoa C Primary Examiner: Levi, Dameon E Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.

Klicken Sie ein Format an und speichern Sie dann die Daten oder geben Sie eine Empfänger-Adresse ein und lassen Sie sich per Email zusenden.

BibTeX Citavi, JabRef, u.a.
(Literaturverwaltung)

PDF kein Volltext!
(Merkzettel, Notizen)

RIS Endnote, Citavi u.a.
(Literaturverwaltung)

MODS
(XML zur Weiterverarbeitung)

oder

Wählen Sie das für Sie passende Zitationsformat und kopieren Sie es dann in die Zwischenablage, lassen es sich per Mail zusenden oder speichern es als PDF-Datei.

Gewünschter Zitations-Stil:

oder

Bitte prüfen Sie, ob die Zitation formal korrekt ist, bevor Sie sie in einer Arbeit verwenden. Benutzen Sie gegebenenfalls den "Exportieren"-Dialog, wenn Sie ein Literaturverwaltungsprogramm verwenden und die Zitat-Angaben selbst formatieren wollen.

Printed wiring board with built-in semiconductor element, and process for producing the same