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- Nachgewiesen in: USPTO Patent Grants
- Sprachen: English
- Patent Number: 8,623,942
- Publication Date: January 07, 2014
- Appl. No: 13/138568
- Application Filed: March 09, 2010
- Assignees: Nippon Soda Co., Ltd. (Tokyo, JP)
- Claim: 1. A liquid curable epoxy resin composition containing the following component (A) and component (B): (A) an epoxy resin; and (B) a clathrate containing (b1) a pyridine derivative represented by formula (I): [chemical expression included] wherein R represents a hydroxy group, a nitro group, an alkyl group, an alkoxy group, an amino group, a sulfo group, an acetamide group, a hydrazine group, or a carboxyl group, and n represents an integer of 1 to 5; and when there are a plurality of R, R may be the same or different, and (b2) at least one selected from the group consisting of 1,8-diazabicyclo[5.4.0]undecene-7 and an imidazole compound represented by formula (II): [chemical expression included] wherein R 1 represents a hydrogen atom, a C1-C10 alkyl group, an aryl group, an arylalkyl group, or a cyanoethyl group, and R 2 to R 4 each represent a hydrogen atom, a nitro group, a halogen atom, a C1-C20 alkyl group, a C1-C20 alkyl group substituted by a hydroxy group, an aryl group, an arylalkyl group, or a C1-C20 acyl group.
- Claim: 2. The curable epoxy resin composition according to claim 1 , further containing an organic solvent.
- Claim: 3. The curable epoxy resin composition according to claim 2 , wherein the organic solvent is a polar solvent.
- Claim: 4. The curable epoxy resin composition according to claim 2 , wherein when methyl ethyl ketone is saturated with the clathrate of the component (B) at 25° C., a concentration of the component (b2) liberated in the methyl ethyl ketone is 5000 ppm or less.
- Claim: 5. The curable epoxy resin composition according to claim 4 , wherein the organic solvent is a polar solvent.
- Claim: 6. The curable epoxy resin composition according to claim 1 , wherein the epoxy resin is a liquid epoxy resin.
- Claim: 7. A curing agent or a curing accelerator for a liquid curable resin composition, containing the following clathrate (B): (B) a clathrate containing (b1) a pyridine derivative represented by formula (I): [chemical expression included] wherein R represents a hydroxy group, a nitro group, an alkyl group, an alkoxy group, an amino group, a sulfo group, an acetamide group, a hydrazine group, or a carboxyl group, and n represents an integer of 1 to 5; and when there are a plurality of R, R may be the same or different, and (b2) at least ne selected from the group consisting of 1,8-diazabicyclo[5.4.0]undecene-7 and an imidazole compound represented by formula (II): [chemical expression included] wherein R 1 represents a hydrogen atom, a C1-C10 alkyl group, an aryl group, an arylalkyl group, or a cyanoethyl group, and R 2 to R 4 each represent a hydrogen atom, a nitro group, a halogen atom, a C1-C20 alkyl group, a C1-C20 alkyl group substituted by a hydroxy group, an aryl group, an arylalkyl group, or a C1-C20 acyl group.
- Claim: 8. The curing agent or the curing accelerator according to claim 7 , wherein the liquid curable resin composition comprises an organic solvent.
- Claim: 9. The curing agent or the curing accelerator according to claim 7 , wherein the liquid curable resin composition comprises a liquid epoxy resin.
- Claim: 10. A clathrate containing: (b1) a pyridine derivative represented by formula (I): [chemical expression included] wherein R represents a hydroxy group, a nitro group, an alkyl group, an alkoxy group, an amino group, a sulfo group, an acetamide group, a hydrazine group, or a carboxyl group, and n represents an integer of 1 to 5; and when there are a plurality of R, R may be the same or different, and (b2) at least one selected from the group consisting of 1,8-diazabicyclo[5.4.0]undecene-7 and an imidazole compound represented by formula (II): [chemical expression included] wherein R 1 represents a hydrogen atom, a C1-C10 alkyl group, an aryl group, an arylalkyl group, or a cyanoethyl group, and R 2 to R 4 each represent a hydrogen atom, a nitro group, a halogen atom, a C1-C20 alkyl group, a C1-C20 alkyl group substituted by a hydroxy group, an aryl group, an arylalkyl group, or a C1-C20 acyl group.
- Current U.S. Class: 523/461
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- Other References: Final Office Action dated Jun. 14, 2013 in copending U.S. Appl. No. 12/733,462. cited by applicant ; International Search Report dated Jun. 15, 2010, in PCT/JP2010/001663, 2 pages. cited by applicant ; Chen et al., “Synthesis, structures of cobalt/copper complexes and magnetic property of copper complex with the mixed ligands 5-nitro-1,3-benzenedicarbmlic acid and imidazole,” Inorganic Chemistry Communications, 2006, 9:300-303. cited by applicant ; Lin et al., “Aromatic Polyoxyalkylene Amidoamines as Curatives for Epoxy Resins—Derivatives from t-Butyl Isophthalic Acid,” Journal of Polymer Research, Apr. 1996, 3(2):97-104. cited by applicant ; Luo et al., “A Novel Bilayer Cobalt(II)—Organic Framework with Nanoscale Channels Accommodating Large Organic Molecules,” Inorganic Chemistry, 2003, 42:4486-4488. cited by applicant ; Office Action dated Feb. 1, 2013 in copending U.S. Appl. No. 12/733,462. cited by applicant ; It Final Office Action dated Sep. 7, 2012 in copending U.S. Appl. No. 12/733,462. cited by applicant ; Office Action dated Sep. 24, 2013, in copending U.S. Appl. No. 13/331,772. cited by applicant
- Primary Examiner: Feely, Michael J
- Attorney, Agent or Firm: Foley & Lardner LLP
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