| Sonstiges: |
- Nachgewiesen in: USPTO Patent Grants
- Sprachen: English
- Patent Number: 9,484,609
- Publication Date: November 01, 2016
- Appl. No: 14/196691
- Application Filed: March 04, 2014
- Assignees: RAYTHEON COMPANY (Waltham, MA, US)
- Claim: 1. A transmission line structure, comprising: a coplanar waveguide transmission line, comprising a pair of separated coplanar waveguide transmissions line sections, each one of the pair of coplanar waveguide sections comprising a center conductor disposed between and a pair of ground plane conductors; and a circuit coupled between a first one of the pair of separated coplanar waveguide transmissions line sections and a second one of the pair the pair of separated coplanar waveguide transmissions line sections for passing differential mode signal transmission between the pair of coplanar waveguide transmissions line sections and for inhibiting common mode energy from passing between the pair of coplanar waveguide transmissions line sections, the circuit comprising: a first portion of the circuit comprising a first inductor member having a first end coupled to a first one of the pair of ground plane conductors of the first of the pair of separated coplanar waveguide transmissions line sections and a second end coupled to a first one of the pair of ground plane conductors of the second one of a pair of separated coplanar waveguide transmissions line sections for inhibiting the common mode energy at the first end of the first inductor member from passing the first inductor member; a second portion of the circuit comprising a second inductor member having a first end coupled to the center conductor of the first of the pair of separated coplanar waveguide transmissions line sections and an second end coupled to the center conductor of the second one of a pair of separated coplanar waveguide transmissions line sections for inhibiting the common mode energy at the first end of the second inductor member from passing out of the second end of the second inductor member.
- Claim: 2. The transmission line structure recited 1 wherein the first inductor member is a serpentine inductor and the second inductor member is a serpentine inductor.
- Claim: 3. The transmission line structure recited 1 inducting a capacitor, and wherein a portion of the first inductor member and the capacitor form a resonant tank circuit tuned to the common mode signal.
- Claim: 4. The transmission line structure recited 1 wherein a third portion of the circuit comprises a third inductor member having a first end coupled to a second one of the pair of ground plane conductors of the first of the pair of separated coplanar waveguide transmissions line sections and a second end coupled to a second one of the pair of ground plane conductors of the second one of a pair of separated coplanar waveguide transmissions line sections for inhibiting the common mode energy at the first end of the third inductor member from passing out of the second end of the third inductor member.
- Claim: 5. The transmission line structure recited in claim 1 including a resistor and wherein one end of the resistor and the first end of the first inductor member are connected to the first one of the pair of ground plane conductors of the first one of the pair of separated coplanar waveguide transmissions line sections.
- Claim: 6. The transmission line structure recited 5 wherein the first inductor is a serpentine inductor and the second inductor is a serpentine inductor.
- Claim: 7. A monolithic integrated circuit, comprising: a substrate; a plurality of devices disposed on a surface of the substrate, a first portion of the plurality of devices being disposed on a first portion of the surface of the substrate and a second portion of the plurality of devices being disposed on a second portion of the substrate; a plurality of coplanar waveguide sections, each one of the coplanar waveguide sections having a center conductor disposed between a pair of ground plane conductors, a first portion of the plurality of coplanar waveguide sections being disposed on the first portion of the surface of the substrate and being connected to the first portion of the plurality of devices and a second portion of the coplanar waveguide sections being disposed on the second portion of the surface of the substrate and being connected to the second portion of the plurality of devices; the first portion of the coplanar waveguide sections being separated from the second portion of the coplanar waveguide sections; wherein the pair of ground plane conductors of the first portion of the plurality of coplanar waveguide sections is spaced from the pair of ground plane conductors of the second portion of the plurality of coplanar waveguide sections by a space between edges of the pair of ground plane conductors of the first portion of the plurality of coplanar waveguide sections and opposing edges of the pair ground plane conductors of the second portion of the plurality of coplanar waveguide sections; wherein the pair of ground plane conductors of the first portion of the plurality of coplanar waveguide sections provide a ground plane for the first portion of the plurality of coplanar waveguide sections connected to a plurality of devices of the first portion of the plurality of devices; a coupling circuit disposed on the substrate in the space between the pair of ground plane conductors of the first portion of the plurality of coplanar waveguide sections and the pair ground plane conductors of the second portion of the plurality of coplanar waveguide sections for suppressing common mode signals, while passing differential mode signal transmission, between the first portion of the plurality of coplanar waveguide sections and the second portion of the coplanar waveguide sections.
- Claim: 8. The monolithic integrated circuit recited in claim 7 wherein the coupling circuit comprises a serpentine inductor for suppressing the common mode signals.
- Claim: 9. The monolithic integrated circuit recited in claim 8 including a ground plane conductor disposed on a bottom of the substrate under the pair of ground plane conductors of one of the plurality of coplanar waveguide sections.
- Claim: 10. The monolithic integrated circuit recited in claim 7 including a ground plane conductor disposed on a bottom of the substrate under the pair of ground plane conductors of one of the plurality of coplanar waveguide sections.
- Claim: 11. A monolithic integrated circuit recited in claim 7 wherein the pair of ground plane conductors of the second portion of the plurality of coplanar waveguide sections provide a ground plane for the second portion of the plurality of coplanar waveguide sections connected to a plurality of devices of the second portion of the plurality of devices.
- Patent References Cited: 5138287 August 1992 Domokos et al. ; 5173671 December 1992 Wendler et al. ; 6023209 February 2000 Faulkner et al. ; 8624688 January 2014 Essenwanger ; 2015/0070102 March 2015 Dai et al.
- Other References: U.S. Appl. No. 14/196,678, filed Mar. 4, 2014, 13 pages. cited by applicant ; Hakan P. Partal., Ph.D., Advanced Implementations of Microwave Passive Circuits, Dept. of EECS, Syracuse University, ELE 791, Summer 2011, pp. 1-18. cited by applicant ; W. Heinrich, J. Gerdes, F.J. Schmuckle, C. Rheinfelder, K. Strohm, Coplanar Passive Elements on Si Substrate for Frequencies up to 110 GHz, Short Papers, IEEE Transactions on Microwave Theory and Techniques, vol. 46, No. 5, May 1998, pp. 709-712. cited by applicant ; Office Action Mailed Jun. 6, 2015 U.S. Appl. No. 14/196,678, filed Jun. 6, 2015. cited by applicant ; T. Gokdemir, S.B. Economides, A. Khalid, A.A. Rezazadeh, I.D. Robertson, Design and Performance of GaAs MMIC Baluns Using Overlaid and Spiral Couplers, Department of Electronic and Electrical Engineering, King's College, Strand, London, 1997 IEEE MIT-S Digest, WE1B-s, pp. 401-404. cited by applicant ; Winifried Bakalski, Werner Simburger, Herbert Knapp, Hans-Dieter Wohlmuth, Arpad L. Scholtz, Lumped and Distributed Lattice-type LC-Baluns, Student Paper, Infineon Technologies AG, Munich, Germany, 2002 IEEE MIT-s Digest, pp. 209-212. cited by applicant ; Kenichi Okada, Kazuya Masu, Modeling of Spiral Inductors, Tokyo Institute of Technology, Japan, Apr. 2010, pp. 292-313. cited by applicant ; Response to Final Rejection filed in U.S. Appl. No. 14/196,678. cited by applicant
- Assistant Examiner: Glenn, Kimberly
- Primary Examiner: Pascal, Robert
- Attorney, Agent or Firm: Daly, Crowley, Mofford & Durkee, LLP
|
