Einzeltreffer — DigiBib

One embodiment described herein provides a co-packaged optics (CPO) switch assembly. The CPO switch assembly includes a switch integrated circuit (IC) chip and a number of optical modules coupled to the switch IC chip. The switch IC chip and the optical modules are co-packaged within a same physical enclosure. The switch IC chip includes a switch logic and a digital signal processing (DSP) unit, and a respective optical module comprises: a photonic integrated chip (PIC), a first amplifier module, and a second amplifier module.

Titel:	Co-packaged optics switch solution based on analog optical engines
Autor/in / Beteiligte Person:	Alibaba Singapore Holding Private Limited
Link:	View record in USPTO Patent Grants (Volltext)
Veröffentlichung:	2023
Medientyp:	Patent
Sonstiges:	Nachgewiesen in: USPTO Patent Grants Sprachen: English Patent Number: 11630,261 Publication Date: April 18, 2023 Appl. No: 17/244611 Application Filed: April 29, 2021 Assignees: ALIBABA SINGAPORE HOLDING PRIVATE LIMITED (Singapore, SG) Claim: 1. A co-packaged optics (CPO) switch assembly, comprising: a switch integrated circuit (IC) chip and a number of optical modules coupled to the switch IC chip; wherein the switch IC chip comprises a switch logic and a digital signal processing (DSP) unit; and wherein a respective optical module comprises: a photonic integrated chip (PIC), a first amplifier module, and a second amplifier module; wherein the switch IC chip and the optical modules are separate circuit modules co-packaged within a same physical enclosure such that the DSP unit within the switch IC chip and the amplifier modules within the respective optical module are on different chips. Claim: 2. The co-packaged optics (CPO) switch assembly of claim 1 , further comprising a micro-controller unit (MCU) coupled to the switch IC chip and the optical module, wherein the micro-controller is external to the optical module and is configured to set operating parameters of components within the DSP unit and the optical module. Claim: 3. The co-packaged optics (CPO) switch assembly of claim 2 , wherein the MCU is configured to: optimize operating parameters of a component within the optical module based on output signals of the DSP unit; and optimize operating parameters of a component within the DSP unit based on output signals of the optical module. Claim: 4. The co-packaged optics (CPO) switch assembly of claim 1 , wherein the DSP unit comprises one or more digital equalizers for equalizing signals transmitted to and/or received from the optical module. Claim: 5. The co-packaged optics (CPO) switch assembly of claim 4 , wherein the digital equalizers comprise one or more of: a feed-forward equalizer (FFE), a decision-feedback equalizer (DFE), a maximum-likelihood sequence estimation (MLSE) equalizer, and a reflection canceller. Claim: 6. The co-packaged optics (CPO) switch assembly of claim 1 , wherein the optical module further comprises a continuous-time linear equalizer (CTLE) for equalizing an analog signal received by the optical module and/or a pre-emphasis equalizer for equalizing an analog signal transmitted by the optical module. Claim: 7. The co-packaged optics (CPO) switch assembly of claim 1 , wherein the PIC comprises a set of optical modulators for transmitting optical signals and a set of photodetectors for receiving optical signals. Claim: 8. The co-packaged optics (CPO) switch assembly of claim 7 , wherein the first amplifier module comprises a set of modulator drivers respectively coupled to the modulators, and wherein the second amplifier module comprises a set of transimpedance amplifiers (TIAs) respectively coupled to the photodetectors. Claim: 9. The co-packaged optics (CPO) switch assembly of claim 1 , wherein the switch IC chip further comprises a digital-to-analog converter (DAC) configured to convert digital signals outputted by the switch logic to analog domain and an analog-to-digital converter (ADC) configured to convert analog signals received from an optical module to digital domain. Claim: 10. A switch integrated circuit (IC) chip to be co-packaged with a plurality of optical modules to form a CPO switch assembly, the switch IC chip comprising: a switch logic; and a digital signal processing (DSP) unit comprising one or more digital equalizers for equalizing signals transmitted to and/or received from the optical modules; wherein the switch IC chip and the optical modules are separate circuit modules co-packaged within a same physical enclosure such that the DSP unit within the switch IC chip and one or more amplifier modules within a respective optical module are on different chips. Claim: 11. The switch IC chip of claim 10 , wherein the digital equalizers comprise one or more of: a feed-forward equalizer (FFE), a decision-feedback equalizer (DFE), a maximum-likelihood sequence estimation (MLSE) equalizer, and a reflection canceller. Claim: 12. The switch IC chip of claim 10 , further comprising a digital-to-analog converter (DAC) configured to convert digital signals outputted by the switch logic to analog domain and an analog-to-digital converter (ADC) configured to convert analog signals received from an optical module to digital domain. Claim: 13. The switch IC chip of claim 10 , wherein the switch IC chip is coupled to a micro-controller unit (MCU) configured to set operating parameters of the digital equalizers. Claim: 14. The switch IC chip of claim 13 , wherein the MCU is configured to optimize the operating parameters of the digital equalizers based on output signals of the optical modules. Claim: 15. An optical module to be co-packaged with a switch integrated circuit (IC) chip to form a CPO switch assembly, the optical module comprising: a photonic integrated chip (PIC); a first amplifier module; and a second amplifier module; wherein the optical module and the switch IC chip are separate circuit modules co-packaged within a same physical enclosure such that the first and second amplifier modules within the optical module and a digital signal processing (DSP) unit within the switch IC chip are on different chips. Claim: 16. The optical module of claim 15 , further comprising a continuous-time linear equalizer (CTLE) for equalizing an analog signal received by the optical module and/or a pre-emphasis equalizer for equalizing an analog signal transmitted by the optical module. Claim: 17. The optical module of claim 15 , wherein the PIC comprises a set of optical modulators for transmitting optical signals and a set of photodetectors for receiving optical signals. Claim: 18. The optical module of claim 17 , wherein the first amplifier module comprises a set of modulator drivers respectively coupled to the modulators, and wherein the second amplifier module comprises a set of transimpedance amplifiers (TIAs) respectively coupled to the photodetectors. Claim: 19. The optical module of claim 15 , wherein the optical module is coupled to a micro-controller unit (MCU) configured to set operating parameters of the amplifiers. Claim: 20. The optical module of claim 19 , wherein the MCU is configured to optimize the operating parameters of the amplifiers based on output signals of the DSP unit located within the switch IC chip. 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Co-packaged optics switch solution based on analog optical engines