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- Nachgewiesen in: USPTO Patent Grants
- Sprachen: English
- Patent Number: 11924,998
- Publication Date: March 05, 2024
- Appl. No: 17/701422
- Application Filed: March 22, 2022
- Assignees: OVH (Roubaix, FR)
- Claim: 1. A hybrid liquid cooling system for at least one rack-mounted immersion case housed within a rack frame, comprising: the at least one immersion case containing a volume of dielectric immersion cooling liquid and at least one electronic assembly submerged in the dielectric immersion cooling liquid, the at least one electronic assembly comprising one or more one heat-generating electronic processing components; a closed-loop fluid distribution arrangement configured to circulate channelized fluid to and from fluidly-coupled elements associated with the at least one immersion case, the closed-loop fluid distribution arrangement comprising a tube channel network; an external cooling module configured to thermally condition the channelized fluid circulated by the closed-loop fluid distribution arrangement in which the channelized fluid having a higher temperature is conditioned into channelized fluid having a lower temperature, the external cooling module comprising a fluidly-coupled input configured to receive the higher-temperature channelized fluid via the closed-loop fluid distribution arrangement and a fluidly-coupled output configured to forward the conditioned lower-temperature channelized fluid via the closed-loop fluid distribution arrangement; a serpentine convection coil, comprising a plurality of helical coils, that is submerged in a vertical orientation within the dielectric immersion cooling liquid and separately disposed from the at least one electronic assembly, the vertically-oriented serpentine convection coil configured with a fluidly-coupled upper port and a fluidly-coupled lower port to fluidly communicate with the closed-loop fluid distribution arrangement, the vertically-oriented serpentine convection coil structured to internally convey the channelized fluid to operatively cool ambient temperatures of the dielectric immersion cooling liquid via thermal convection flow and the lower-temperature channelized fluid forwarded by the cooling module via the closed-loop fluid distribution arrangement; and one or more fluid cooling blocks arranged to be in direct thermal contact with the one or more heat-generating electronic processing components, the one or more fluid cooling blocks fluidly-coupled to the closed-loop fluid distribution arrangement and configured to cool the one or more heat-generating electronic processing components based on the lower-temperature channelized fluid forwarded by the cooling module via the closed-loop fluid distribution arrangement.
- Claim: 2. The hybrid liquid cooling system of claim 1 , further comprising an external cooling source configured to provide lower temperature fluid flow to the external cooling module to facilitate the thermal conditioning by the external cooling module of the higher-temperature channelized fluid into the lower-temperature channelized fluid.
- Claim: 3. The hybrid liquid cooling system of claim 2 , wherein the external cooling source comprises a dry cooling unit configured to provide lower temperature air flow to the external cooling module.
- Claim: 4. The hybrid liquid cooling system of claim 1 , wherein the tube channel network of the closed-loop fluid distribution arrangement is configured to facilitate the circulation of the channelized fluid between the fluidly-coupled serpentine convection coil, the fluidly-coupled one or more fluid cooling blocks, and the fluidly-coupled external cooling module.
- Claim: 5. The hybrid liquid cooling system of claim 1 , wherein the closed-loop fluid distribution arrangement comprises at least one pump fluidly-coupled to the external cooling module and the tube channel network and configured to displace and circulate the channelized fluid.
- Claim: 6. The hybrid liquid cooling system of claim 1 , wherein the one or more one heat-generating electronic processing components comprise general processing units and/or specialized processing units.
- Claim: 7. The hybrid liquid cooling system of claim 1 , wherein the at least one electronic assembly comprises one or more random access memory units and/or one or more hard disk storage units.
- Claim: 8. The hybrid liquid cooling system of claim 1 , wherein the vertically-oriented serpentine convection coil is structured to have a compact overall length and width dimensions, in which the compact length is greater than the compact width.
- Claim: 9. The hybrid liquid cooling system of claim 1 , wherein the vertically-oriented serpentine convection coil is positioned adjacent to locations of the one or more heat-generating electronic processing components disposed on the at least one electronic assembly.
- Claim: 10. The hybrid liquid cooling system of claim 1 , wherein the tube channel network is configured to: circulate the lower-temperature channelized fluid from the external cooling module to the fluidly-coupled vertically-oriented serpentine convection coil and/or the fluidly-coupled one or more fluid cooling blocks for cooling operations, and circulate the higher-temperature channelized fluid from the fluidly-coupled vertically-oriented serpentine convection coil and/or the fluidly-coupled one or more fluid cooling blocks back to the external cooling module for conditioning into the lower-temperature channelized fluid.
- Claim: 11. The hybrid liquid cooling system of claim 1 , wherein the tube channel network is structured to: route the lower-temperature channelized fluid from the external cooling module to at least one fluid cooling block; and route a resulting higher-temperature channelized fluid output from the at least one cooling block to the upper port of the vertically-oriented serpentine convection coil, wherein the lower port of the vertically-oriented serpentine convection coil forwards the higher-temperature channelized fluid to the external cooling module for thermal conditioning into the lower-temperature channelized fluid.
- Claim: 12. The hybrid liquid cooling system of claim 1 , wherein the tube channel network is structured to: route the lower-temperature channelized fluid from the external cooling module to at least one fluid cooling block; and route a resulting higher-temperature channelized fluid output from the at least one fluid cooling block to the lower port of the vertically-oriented serpentine convection coil, wherein the upper port of the vertically-oriented serpentine convection coil forwards the higher-temperature channelized fluid to the external cooling module for thermal conditioning into the lower-temperature channelized fluid.
- Claim: 13. The hybrid liquid cooling system of claim 1 , wherein the tube channel network is structured to: route the lower-temperature channelized fluid from the external cooling module to the lower port of the vertically-oriented serpentine convection coil; and route the lower-temperature channelized fluid from the upper port of the vertically-oriented serpentine convection coil to at least one fluid cooling block, wherein a resulting higher-temperature channelized fluid output from the at least one fluid cooling block is forwarded to the external cooling module for thermal conditioning into the lower-temperature channelized fluid.
- Claim: 14. The hybrid liquid cooling system of claim 1 , wherein the tube channel network is structured to: route the lower-temperature channelized fluid from the external cooling module to the upper port of the vertically-oriented serpentine convection coil; and route the lower-temperature channelized fluid from the lower portion port of the vertically-oriented serpentine convection coil to at least one fluid cooling block, wherein a resulting higher-temperature channelized fluid output from the at least one fluid cooling block is forwarded to the external cooling module for thermal conditioning into the lower-temperature channelized fluid.
- Claim: 15. The hybrid liquid cooling system of claim 1 , wherein the at least one fluid cooling block comprises a first fluid cooling block and a second fluid cooling block that are fluidly-coupled in series with each other.
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- Primary Examiner: Jalali, Amir A
- Attorney, Agent or Firm: BCF LLP
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