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Apparatus and methods for improving thermal chemical vapor deposition (CVD) uniformity

Applied Materials, Inc.
2024
Online Patent

Titel:
Apparatus and methods for improving thermal chemical vapor deposition (CVD) uniformity
Autor/in / Beteiligte Person: Applied Materials, Inc.
Link:
Veröffentlichung: 2024
Medientyp: Patent
Sonstiges:
  • Nachgewiesen in: USPTO Patent Grants
  • Sprachen: English
  • Patent Number: 11939,675
  • Publication Date: March 26, 2024
  • Appl. No: 16/636659
  • Application Filed: August 10, 2018
  • Assignees: Applied Materials, Inc. (Santa Clara, CA, US)
  • Claim: 1. A face plate, comprising: a body having a first surface region and a second surface region surrounding the first surface region, the first surface region recessed relative to the second surface region, the first surface region having a first emissivity and the second surface region having a second emissivity, the second emissivity different than the first emissivity; a first plurality of holes formed through the face plate in the first surface region; and a second plurality of holes formed through the face plate in the second surface region.
  • Claim: 2. The face plate of claim 1 , wherein the first surface region has a first thickness and the second surface region has a second thickness different than the first thickness.
  • Claim: 3. The face plate of claim 1 , wherein the first plurality of holes are disposed in the first surface region in a first density and the second plurality of holes are disposed in the second surface region in a second density, the second density being different than the first density.
  • Claim: 4. The face plate of claim 1 , wherein the first plurality of holes have a first diameter and the second plurality of holes have a second diameter, the second diameter being different than the first diameter.
  • Claim: 5. The face plate of claim 3 , wherein the first density is higher than the second density.
  • Claim: 6. The face plate of claim 3 , wherein the first density is lower than the second density.
  • Claim: 7. The face plate of claim 1 , wherein the first emissivity is higher than the second emissivity.
  • Claim: 8. The face plate of claim 1 , wherein the first surface region has a radius of approximately 20% to 40% of the radius of the second surface region.
  • Claim: 9. A blocker plate, comprising: a body having a first surface region and a second surface region surrounding the first surface region, the first surface region having a first emissivity and the second surface region having a second emissivity, the second emissivity different than the first emissivity; and a plurality of gas distribution holes formed through the blocker plate in the first surface region and the second surface region, the gas distribution holes in the first surface region having a first density, the gas distribution holes in the second surface region having a second density, the second density different than the first density.
  • Claim: 10. The blocker plate of claim 9 , wherein the gas distribution holes in the first surface region have a first diameter and the gas distribution holes in the second surface region have a second diameter, the second diameter different than the first diameter, and wherein the first surface region is recessed relative to the second surface region.
  • Claim: 11. The blocker plate of claim 9 , wherein the first surface region of the blocker plate has a first thickness, and the second surface region of the blocker plate has a second thickness, the second thickness different than the first thickness.
  • Claim: 12. The blocker plate of claim 9 , wherein the first emissivity is higher than the second emissivity.
  • Claim: 13. An apparatus for depositing a film on a substrate, comprising: a chamber body and a chamber lid defining a process volume therein; a substrate support disposed in the process volume; a blocker plate disposed in the process volume opposite the substrate support, the blocker plate having a plurality of holes formed therethrough; and a face plate having a plurality of holes formed therethrough, the face plate disposed in the process volume between the blocker plate and the substrate support, the face plate at least partially defining a volume between the face plate and the blocker plate, the face plate having a first surface region with a first emissivity and a second surface region with a second emissivity surrounding the first surface region, the first surface region recessed relative to the second surface region and the second emissivity different than the first emissivity.
  • Claim: 14. The apparatus of claim 13 , wherein the first surface region has a first thickness and the second surface region has a second thickness, the second thickness different than the first thickness.
  • Claim: 15. The apparatus of claim 13 , wherein the face plate further comprises: a first plurality of gas distribution holes formed through the first surface region, the first plurality of gas distribution holes having a first density, each of the first plurality of gas distribution holes having a first diameter; and a second plurality of gas distribution holes formed through the second surface region, the second plurality of gas distribution holes having a second density, the second density different than the first density, each of the second plurality of gas distribution holes having a second diameter, the second diameter different than the first diameter.
  • Claim: 16. The apparatus of claim 13 , further comprising: a radiation shield having a plurality of holes formed therethrough, the radiation shield disposed in the process volume opposite the face plate such that the substrate support is between the face plate and the radiation shield, the radiation shield disposed around a shaft of the substrate support.
  • Claim: 17. The apparatus of claim 16 , wherein the plurality of holes in the radiation shield are arranged in a first circumferential pattern, a second circumferential pattern, and a third circumferential pattern, the first circumferential pattern and second circumferential pattern having a first density of holes and the third circumferential pattern having a second density of holes, the first circumferential pattern, second circumferential pattern, and third circumferential pattern each formed around a common axis of the radiation shield.
  • Claim: 18. The apparatus of claim 16 , wherein the shaft comprises a plurality of holes formed therethrough at an upper end of the shaft adjacent to the substrate support for flowing a gas in a radial direction.
  • Claim: 19. The apparatus of claim 13 , wherein the first emissivity is higher than the second emissivity.
  • Claim: 20. The apparatus of claim 13 , wherein the first surface region has a radius of approximately 20% to 40% of the radius of the second surface region.
  • Patent References Cited: 4134425 January 1979 Gussefeld ; 5133284 July 1992 Thomas ; 6001175 December 1999 Maruyama ; 20010027026 October 2001 Dhindsa ; 20040094094 May 2004 Ohmi et al. ; 20080134974 June 2008 Takahashi et al. ; 20080305246 December 2008 Choi et al. ; 20120108066 May 2012 New ; 20130126515 May 2013 Shero et al. ; 20130164948 June 2013 Romero ; 20130334344 December 2013 Leeser ; 20150184301 July 2015 Saido ; 20160307752 October 2016 Kulshreshtha et al. ; 20170167024 June 2017 Wiltse et al. ; 20180030617 February 2018 Kang ; 1359531 July 2002 ; 101005011 July 2007 ; 102084461 June 2011 ; 103361635 October 2013 ; 106715753 May 2017 ; 106906453 June 2017 ; H08239295 September 1996 ; 11279778 October 1999 ; H11279778 October 1999 ; 2002299240 October 2002 ; 2012042329 March 2012 ; 2012142329 July 2012 ; 2012234904 November 2012 ; 2017112371 June 2017 ; 2002299240 October 2022 ; 20030093283 December 2003 ; 20110028377 March 2011 ; 20120074878 July 2012 ; 20150049180 May 2015 ; 20170063943 June 2017 ; 9949101 September 1999 ; 2007018157 February 2007 ; 2013163079 October 2013
  • Other References: International Search Report and Written Opinion for Application No. PCT/US2018/046344 dated Dec. 4, 2018. cited by applicant ; Korean Office Action dated Jan. 6, 2023 for Application No. 10-2020-7005044. cited by applicant ; Chinese Office Action for Application No. 201880056745.6 dated Mar. 14, 2023. cited by applicant ; Japanese Office Action for Application No. 2020-506157 dated Apr. 11, 2023. cited by applicant ; Japanese Office Action (“Notice of Reasons for Rejection”) dated Sep. 6, 2022 for Japanese Patent Application No. 2020-506157. cited by applicant ; Korean Office Action for Application No. 10-2020-7005044 dated Jul. 1, 2023. cited by applicant
  • Primary Examiner: Chen, Keath T
  • Attorney, Agent or Firm: Patterson + Sheridan, LLP ; Taboada, Keith

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