High Speed Interconnects Made of Composite Materials for VLSI Application
In: Contemporary Trends in Semiconductor Devices : Theory, Experiment and Applications, Jg. 850 (2022), S. 227-247
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Zugriff:
| Titel: |
High Speed Interconnects Made of Composite Materials for VLSI Application
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| Autor/in / Beteiligte Person: | De, Souradeep ; Baruah, Bhabana ; Maity, Santanu ; Angrisani, Leopoldo, Series Editor ; Arteaga, Marco, Series Editor ; Panigrahi, Bijaya Ketan, Series Editor ; Chakraborty, Samarjit, Series Editor ; Chen, Jiming, Series Editor ; Chen, Shanben, Series Editor ; Chen, Tan Kay, Series Editor ; Dillmann, Rüdiger, Series Editor ; Duan, Haibin, Series Editor ; Ferrari, Gianluigi, Series Editor ; Ferre, Manuel, Series Editor ; Hirche, Sandra, Series Editor ; Jabbari, Faryar, Series Editor ; Jia, Limin, Series Editor ; Kacprzyk, Janusz, Series Editor ; Khamis, Alaa, Series Editor ; Kroeger, Torsten, Series Editor ; Li, Yong, Series Editor ; Liang, Qilian, Series Editor ; Martín, Ferran, Series Editor ; Ming, Tan Cher, Series Editor ; Minker, Wolfgang, Series Editor ; Misra, Pradeep, Series Editor ; Möller, Sebastian, Series Editor ; Mukhopadhyay, Subhas, Series Editor ; Ning, Cun-Zheng, Series Editor ; Nishida, Toyoaki, Series Editor ; Pascucci, Federica, Series Editor ; Qin, Yong, Series Editor ; Seng, Gan Woon, Series Editor ; Speidel, Joachim, Series Editor ; Veiga, Germano, Series Editor ; Wu, Haitao, Series Editor ; Zamboni, Walter, Series Editor ; Zhang, Junjie James, Series Editor ; Goswami, Rupam [Ed.] ; Saha, Rajesh [Ed.] |
| Zeitschrift: | Contemporary Trends in Semiconductor Devices : Theory, Experiment and Applications, Jg. 850 (2022), S. 227-247 |
| Veröffentlichung: | 2022 |
| Medientyp: | E-Book |
| ISBN: | 978-981-16-9123-2 (print) ; 978-981-16-9124-9 (print) |
| DOI: | 10.1007/978-981-16-9124-9_11 |
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